| item | capability | |||
| 2023 | ||||
| material | fr4 | |||
| tg135~tg200 | ||||
| halogen-free fr-4 | ||||
| aluminum/copper | ||||
| min. dielectric thickness | 2mil | |||
| max. layer counts | 50 | |||
| max. pcb size | 22"x29" | |||
| max. pcb thickness | 0.250" | |||
| min. pcb thickness | 0.016"(6l) | |||
| 0.012"(2l) | ||||
| min trace width/gap | inner layer | 1.6/2mil | ||
| outer layer | 2.0/2.0mil | |||
| warpage & twist | 0.003"/in. | |||
| min. smd pitch | 14mil | |||
| layer registration | 4mil | |||
| fhs | mechanical | 0.004" | ||
| laser | 0.003" | |||
| drill hole position | /-.002" | |||
| hole size tolerance | pth | /-.002" | ||
| npth | /-.001" | |||
| aspect ratio | (thickness/fhs) | 33 | ||
| max. copper | inner layer | 12 oz | ||
| outer layer | 8 oz | |||
| blind/buried via | 1 1 1 1 n 1 1 1 1 | |||
| vip-c &vip-n | ||||
| stacked via、
staggered vias |
||||
| back drill | /-2mil | |||
| pcb profile tolerance | /-3mil | |||
| surface finished | hasl/lead-free | |||
| enig | ||||
| enig w/ pd | ||||
| immersion silver | ||||
| osp | ||||
| carbon ink | ||||
| immersion/electrical tin | ||||
| selective/full body gold | ||||
| peelable | ||||
| immpedance control | /-5% | |||
|
special process |
coin inlay、copper paste plugged hole |
|||
